Hot Air Rework Station

The Rework Soldering Stations ensures rapid heating up, accurate and stable temperature control without being affected by the volume of airflow. Suitable for QFP, PLCC, SOIC, CHIP, BGA, SMC and temperature-sensitive components, these stations are stringently tested on various parameters. Besides, these rework stations are widely used for drying, lacquer removal, heating shrink, viscidity removal, ice-out, pre-heating and glue soldering. Available for clients in varied specifications, these are manufactured under the supervision of our deft professionals.

Hot Air Rework Station Analogue implements an advanced diaphragm pump design that also incorporates soldering iron. It provides excellent temperature tolerances and large air flows for removing solder and other electric components from circuit boards. The fast revival feature of this rework station makes it suitable for use with regular solder containing lead. Besides, it is integrated with advanced technology to track the temperature of the hot air heating element and the soldering iron heating element which allows it to quickly react and keep temperatures steady.